
氮气流量、基体温度对反应溅射(Ti,Al)N 成膜影响
Effects of N2 Flow Rate and Substrate Temperature on (Ti, Al)N Films Deposited by Reactive Sputtering
{{custom_ref.label}} |
{{custom_citation.content}}
{{custom_citation.annotation}}
|
/
〈 |
|
〉 |